There is a global need for electronics that are safe, reliable, and trustworthy, especially for harsh environments under wide range of temperature, humidity, and radiation conditions. The design, manufacturing, testing, and use of these microchips is challenged by a number of factors, including disruptions of the manufacturing chain as well as an urgent need for a rapid increase in the skilled electronics workforce, as well as parts evaluation engineers. The proposed partnership between UCF CECS and the NASA Electronics Parts and Packaging (NEPP) program will address this need, and UCF will be the first partner university for Space and defense electronics applications, meeting the needs of our graduates and of our industrial partners.
The NEPP is encouraging the development of a NASA Parts Engineering Program alongside university partners through NASA center-wide collaborations between NASA Jet Propulsion Laboratory (JPL), Goddard Space Flight Center (GSFC), Marshall Space Flight Center (MSFC), Langley Research Center (LaRC), and Kennedy Space Center (KSC). The program will address the knowledge gap in the current electronic parts engineering workforce and will lead to increases in the number of trained professionals in the workforce, including the cultivation of the next generation of Parts Engineers.
Students in this program will gain knowledge of engineering assessment, reliability-related performance for all Electrical Electronic Electromechanical (EEE) parts. Outcome of the students will be greatly supporting projects with part selection that maximizes reliability appropriate for the project life cycle while considering schedule and cost constraints. They will have strong abilities to oversee part procurement and work with parts manufacturers to ensure compliance with engineering requirements. They will understand how to establish testing plans for EEE parts, including screening and qualification test campaigns and any required failure analysis, and evaluating test results for proper disposition for space flight usage. Students will also be able to assess capabilities of new EEE technologies and suppliers for spaceflight use. These skills will not only be of use to NASA, but to the rapidly growing space industry, and to critical infrastructure supporting the use of microelectronic devices and integrated circuits in harsh environments.
Please note: Electronic Parts Engineering Graduate Certificate may be completed fully online.
Newly admitted students choosing to complete this program exclusively via UCF online classes may enroll with a reduction in campus-based fees.
International students (F or J visa) are required to enroll in a full-time course load of 9 credit hours during the fall and spring semesters. Only 3 of the 9 credit hours may be taken in a completely online format. For a detailed listing of enrollment requirements for international students, please visit . If you have questions, please consult UCF Global at 407-823-2337. UCF is not authorized to provide online courses or instruction to students in some states. Refer to State Restrictions for current information.
Program Prerequisites
- Academic Background:
- A bachelor's degree in a STEM field such as Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a closely related discipline.
- Minimum GPA of 3.0 on a 4.0 scale in undergraduate coursework.
- Fundamental Knowledge Required:
- Prior coursework or demonstrated competence in the following areas:
- Circuit analysis and electronic devices (e.g., diodes, MOSFETs, BJTs)
- Basic materials science or semiconductor physics
- Probability and statistics for engineering applications
- Additional Expectations:
- Students without prior exposure to semiconductor or reliability topics may be advised to take EEE3350 (Semiconductor Devices), or EEE3307C (Electronics I) or EEE4344 (Fundamentals of Microelectronics) as background preparation.
- Professional engineers with relevant industry experience may petition to waive formal prerequisites with faculty approval.
Degree Requirements
12 - 14 Total Credits
- Complete all of the following
- Complete all of the following
- Complete at least 2 of the following:
- EEE5352 - Semiconductor Material and Device Characterization (3)
- ESI5236 - Reliability Engineering (3)
- EEL5245 - Power Electronics (3)
- EEE5416 - Radiation Effects and Reliability in Microelectronics (3)
- Students can also choose course: EEL 5937 - ST: Introduction to Space Electronics (3)
- Complete at least 2 of the following:
- EEE5323 - Radio Frequency Integrated Circuit Design (3)
- EEE5353 - Semiconductor Device Modeling and Simulation (3)
- EEL5659 - Introduction to Sensors (3)
- EEL5439C - RF and Microwave Active Circuits (4)
- EEL5722C - Field-Programmable Gate Array (FPGA) Design (3)
- EMA5415 - Electronic Principles of Materials Properties (3)
- EEE5356C - Fabrication of Solid-State Devices (4)
- ESI5219 - Engineering Statistics (3)
- EEE6326C - MEMS Fabrication Laboratory (3)
- EEE6317 - Power Semiconductor Devices and Integrated Circuits (3)
- EEE5332C - Thin Film Technology (3)
- EML6233 - Fundamentals of Fatigue Analysis (3)
- EEE6338 - Advanced Topics in Microelectronics (3)
Grand Total Credits: 12 - 14
Financial Information
Graduate students may receive financial assistance through fellowships, assistantships, tuition support, or loans. For more information, see the College of Graduate Studies Funding website, which describes the types of financial assistance available at UCF and provides general guidance in planning your graduate finances. The Financial Information section of the Graduate Catalog is another key resource.
Fellowship Information
Fellowships are awarded based on academic merit to highly qualified students. They are paid to students through the Office of Student Financial Assistance, based on instructions provided by the College of Graduate Studies. Fellowships are given to support a student's graduate study and do not have a work obligation. For more information, see UCF Graduate Fellowships, which includes descriptions of university fellowships and what you should do to be considered for a fellowship.
- Opportunities for internships in NASA, DOD labs and industrial partners.
- Potential scholarships and awards.
Program Description
The Electronic Parts Engineering Graduate Certificate prepares graduate students and working professionals for careers in the evaluation, qualification, and assurance of electrical, electronic, and electromechanical (EEE) parts used in space, defense, and other high-reliability environments. The program was developed in partnership with NASA 麻豆精品 S檚 Electronic Parts and Packaging (NEPP) program and the Department of Defense Microelectronics Commons initiative to address critical national workforce needs in radiation-hardened microelectronics, reliability engineering, and materials assurance.
Students gain advanced knowledge in device physics, radiation effects, packaging, and qualification standards (e.g., MIL-STD-883, NASA-STD-8739.10, and ECSS-Q-ST-60) and apply this knowledge through laboratory experiences and collaborative research with NASA centers, defense contractors, and industry partners.
The program supports Florida 麻豆精品 S檚 Space Coast industry ecosystem and national microelectronics workforce initiatives by producing engineers capable of bridging the gap between design, fabrication, and system qualification.
Program Objectives
Graduates of this program will be able to:
- Evaluate and model the performance and degradation of EEE parts under radiation, thermal, and electrical stress.
- Apply qualification and screening standards (NASA-STD-8739.10, MIL-STD-883, ECSS-Q-ST-60) in part selection and system assurance.
- Conduct materials, electrical, and reliability testing using advanced laboratory and simulation tools.
- Interface effectively with mission assurance, test, and design teams to ensure component reliability in critical applications.
- Contribute to the national and international workforce in high-reliability microelectronics and packaging engineering.
Program Structure
- Course Requirement: Minimum of 2 core and 2 elective courses. Some elective courses may not be available online every semester.
- Minimum Grade: B (3.0) or higher in all courses
- Delivery Mode: 100% online or hybrid
- Typical Completion Time: 2 麻豆精品 S�3 semesters
Learning Outcomes
Graduates of this program will be able to:
- Conduct materials and electrical characterization of EEE components.
- Analyze and interpret failure modes and testing data.
- Apply standards and best practices for parts procurement and qualification.
- Interface with manufacturers and mission assurance teams.
Internships and Research Opportunities
Students are encouraged to pursue internships and research experiences with NASA centers, DoD labs, and industry partners. Opportunities may be coordinated through faculty advisors and affiliated programs.
